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US 12,570,534 B2Granted
Hollow particle, method of producing the hollow particle, resin composition, and resin molded product and laminate each using the resin composition
AssigneeSETOLAS Holdings, Inc.
InventorsPhuong Nguyen Duy Dao, Tsukasa Nakamura
Life of this patent
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Abstract
Provided is a hollow particle, including silica, having a DSL of primary particles that satisfies the following expression (1), and having a breaking strength of 10 MPa or more: 1≤DSL≤1.5 . . . (1) where DSL=D75L/D25L, and D25L and D75L represent a 25th value and a 75th value, respectively, when long diameters of 100 randomly selected primary particles are measured in observation with a scanning electron microscope and sorted in order of increasing size.
Claims21
A hollow particle, comprising silica and Al,
- having a molar ratio of Al/Si of 0.0001 or more and 0.04 or less,
- having a breaking strength of 10 MPa or more, and
- having a DSL of primary particles that satisfies the following expression (1):
- 1≤DSL≤1.5 (1)
- where DSL=D75L/D25L, and D25L and D75L represent a 25th value and a 75th value, respectively, when long diameters of 100 randomly selected primary particles are measured in observation with a scanning electron microscope and sorted in order of increasing size.
2 more elements
Dependencies are inferred from the claim text.