Substrate alignment
AssigneeHewlett-Packard Development Company, L.P.
InventorsJosep Maria Bel Calavia, Ignasi Bonjoch Roma, Andreu Vinets Alonso
Life of this patent
Estimating the term…
Abstract
Example implementations provide a controller comprising circuitry to align a substrate; the controller comprising: circuitry to control varying the tension of an unspooled portion of the substrate between a spool bearing the substrate and a pinch roller; said circuitry comprising circuitry to control varying the pinch load exerted by the pinch roller on the unspooled portion of the substrate.
Claims6
A controller comprising circuitry to align a substrate;
- the controller comprising:
- circuitry to control varying a tension of a section of an unspooled portion of the substrate between a spool bearing the substrate and a pinch roller;
- said circuitry comprising circuitry to control varying a pinch load exerted by the pinch roller on the section of the unspooled portion of the substrate, wherein the tension on the section of the unspooled portion of the substrate comprises a first tension during alignment of the substrate prior to printing on the substrate and a second tension during printing on the substrate, where the first tension is different from the second tension, wherein the first tension is greater than the second tension.
A printer to print on a substrate, the printer comprising
- an alignment mechanism to reduce skew of the substrate,
- the alignment mechanism comprising:
- a tensioning mechanism to adjust a frictional coupling between a section of an unspooled portion of the substrate and at least one pinch roller,
- the tensioning mechanism comprising
- at least one actuator for varying the frictional coupling between the at least one pinch roller and the section of the unspooled portion of the substrate, wherein the frictional coupling between the section of the unspooled portion of the substrate and the at least one pinch roller comprises a first frictional coupling during alignment of the substrate prior to printing on the substrate and a second frictional coupling during printing on the substrate, where the first frictional coupling is different from the second frictional coupling.
An apparatus to reduce skew of a substrate in a substrate advance assembly, the apparatus comprising:
- a controller comprising:
- circuitry to control varying a tension of a section of an unspooled portion of the substrate between a spool bearing the substrate and a pinch roller;
- said circuitry comprising circuitry to control varying a pinch load exerted by the pinch roller on the section of the unspooled portion of the substrate, wherein the tension on the section of the unspooled portion of the substrate comprises a first tension during alignment of the substrate prior to printing on the substrate and a second tension during printing on the substrate, where the first tension is different from the second tension, and a control mechanism to vary an alignment tension of the section of the unspooled portion of the substrate;
- said substrate being biased against a forward motion of the substrate through the substrate advance assembly,
- the control mechanism to apply the alignment tension comprising:
- an actuator to vary the pinch roller load, exerted by the pinch roller, on the section of the unspooled portion of the substrate during movement of the substrate;
- and
- a drive mechanism to move the substrate through the substrate advance assembly under the alignment tension, wherein the first tension is greater than the second tension.
Dependencies are inferred from the claim text.