Polishing apparatus, polishing method, and cleaning liquid supply device

A polishing apparatus for polishing a processed material by rotating an endless abrasive belt having an abrasive surface, the polishing apparatus comprising:

• a frame body;
• a first roll around which the endless abrasive belt is wound with the surface opposite to the abrasive surface of the belt being in pressure-contact with the first roll, the first roll rotatably supported by the frame body;
• a second roll around which the abrasive belt is not wound, the second roll disposed to be parallel to the first roll so as to be spaced from the processed material and face the abrasive surface, the second roll rotatably supported by the frame body so as to be in pressure-contact with the first roll via the endless abrasive belt;
• and
• a cleaning liquid supply pipe having at least one discharge port for discharging a cleaning liquid, the cleaning liquid supply pipe supported by the frame body such that the discharge port faces the outer surface of the second roll,
• wherein the cleaning liquid discharged from the at least one discharge port onto the outer peripheral surface of the second roll is carried to a contact portion between the first roll and the second roll as the second roll rotates, and
• wherein the pressure-contact between the first roll and the second roll prevents the cleaning liquid from passing through the contact portion.