Display panel and manufacturing method thereof

A method of manufacturing a display panel comprising:

• growing an undoped semiconductor layer, an N-type semiconductor layer, a multi-quantum well layer and a P-type semiconductor layer on a substrate in sequence;
• forming a transient substrate on a side of the P-type semiconductor layer away from the substrate;
• stripping the substrate to expose the undoped semiconductor layer;
• patterning the undoped semiconductor layer to form a conductive via on the undoped semiconductor layer;
• forming a conductive pattern portion on the undoped semiconductor layer, a part of the conductive pattern portion filling in the conductive via and being in contact with the N-type semiconductor layer, so that a light-emitting chip is formed, and another part of the conductive pattern portion protruding from the conductive via;
• providing a drive backplane;
• forming a drive circuit on the drive backplane;
• forming a reflective layer at a position corresponding to each light-emitting chip, and forming a via on the reflective layer for filling a conductive connection portion, wherein the reflective layer is insulated from the conductive pattern portion, the conductive connection portion and the drive backplane, and wherein an orthographic projection of the light-emitting chip on the drive backplane is located in the reflective layer;
• forming a conductive connection portion at a connection of the conductive pattern portion and the drive circuit by heating and melting indium or tin, wherein the conductive pattern portion is electrically connected to the conductive connection portion;
• binding and connecting the drive backplane with the part of the conductive pattern portion protruding from the conductive via, and stripping the transient substrate.