Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device

A film comprising:

• a compound (A) comprising:
• 2,2-bis{4-(4-maleimidophenoxy)phenyl}propane;
• a maleimide compound represented by the following formula (6)
• wherein n3 represents an integer of 1 or more and 30 or less;
• a maleimide compound represented by the following formula (7)
• wherein each R8 independently represents a hydrogen atom, a methyl group, or an ethyl group, and each R9 independently represents a hydrogen atom or a methyl group;
• and
• a maleimide compound represented by the following formula (8)
• wherein each R10 independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n4 represents an integer of 1 or more and 10 or less;
• an organic peroxide (B) comprising at least one selected from the group consisting of organic peroxides represented by the following formula (1) and the following formula (2);
• and
• a hydroperoxide (C):
• wherein each R1 independently represents a hydrogen atom, a methyl group, or an ethyl group;
• wherein each R2 independently represents a hydrogen atom, a methyl group, or an ethyl group, and X1 represents a group represented by the following formula (3) or (4);
• wherein R3 represents a hydrogen atom, a methyl group, or an ethyl group, R4 represents an alkylene group having 1 or more and 3 or less carbon atoms, and R5 represents a hydrogen atom or an alkyl group having 1 or more and 6 or less carbon atoms;
• wherein each R6 independently represents a hydrogen atom, a methyl group, or an ethyl group, and X2 represents a group represented by the following formulae (a) to (c);
• and
• wherein n1 represents an integer of 1 or more and 5 or less.