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US 12,568,813 B2Granted
Interconnector and electronic apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungseok Park, Eunji Yang, Junyoung Kwon
Life of this patent
Estimating the term…
Abstract
Provided are an interconnector and an electronic apparatus including the interconnector. The interconnector includes: a metal layer; a dielectric layer surrounding at least a portion of the metal layer; and an interlayer disposed between the metal layer and the dielectric layer and including a ternary metal oxide.
Claims20
An interconnector comprising:
- a dielectric layer with a trench;
- a metal layer in the trench of the dielectric layer so that a lower surface and both lateral surfaces of the metal layer are surrounded by the dielectric layer;
- and
- an interlayer between the metal layer and the dielectric layer in the trench and comprising a ternary metal oxide.
1 more element
A method of forming an interposed, comprising:
- provisioning a porous, single-layer dielectric layer;
- forming a trench in the porous, single-layer dielectric layer;
- depositing a ternary metal oxide in a sidewall of the trench;
- and
- filling the trench with a metal, wherein
- the porous, single-layer dielectric layer surrounds a bottom of and side surfaces of the trench.
3 more elements
Dependencies are inferred from the claim text.