Cooling block assembly for cooling a heat-generating electronic component

A cooling block assembly for cooling a heat-generating electronic component, comprising:

• an upper block portion defining at least one internal fluid conduit for circulating a cooling fluid therethrough, each of the at least one internal fluid conduit having an inlet and an outlet for receiving and discharging the cooling fluid respectively,
• the upper block portion having a lower surface configured to face toward the heat-generating electronic component;
• a boss connected to the upper block portion, the boss being spaced from the lower surface of the upper block portion, the boss having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface in a height direction of the cooling block assembly,
• the boss being dimensioned such that a periphery of the thermal transfer surface is smaller than a periphery of the upper block portion,
• the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface;
• and
• a plurality of heat distributing devices configured for distributing heat through a phase change of a working substance contained within each heat distributing device, each heat distributing device being disposed partially between the boss and the lower surface of the upper block portion to distribute heat from the boss to the lower surface.