Antenna module

An apparatus comprising:

• a multilayer substrate in which a plurality of conductor layers including a first insulating layer and a plurality of insulating layers are alternately stacked;
• and
• an electronic component embedded in the first insulating layer and having a plurality of pad electrodes including a first signal pad and a ground pad,
• wherein the plurality of conductor layers have a first signal pattern, a second signal pattern, a first ground pattern, and a second ground pattern,
• wherein the first signal pattern and the first ground pattern are disposed on one side in the stacking direction with respect to the first insulating layer in which the electronic component is embedded,
• wherein the second signal pattern and the second ground pattern are disposed on another side in the stacking direction with respect to the first insulating layer,
• wherein the first signal pad of the electronic component is connected to the first signal pattern, and the ground pad of the electronic component is connected to the first ground pattern,
• wherein the first signal pattern and the second signal pattern are connected to each other through a first via conductor penetrating the first insulating layer,
• wherein the second signal pattern is electrically connected to an antenna pattern formed in any one of the plurality of conductor layers,
• wherein the first ground pattern and the second ground pattern are connected to each other through a second via conductor penetrating the first insulating layer,
• wherein the first ground pattern is electrically connected to a ground terminal, and
• wherein a distance between the electronic component and the first via conductor is larger than a distance between the electronic component and the second via conductor.