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US 12,568,572 B2Granted
Ultraviolet glue-controlled impedance
AssigneeDell Products L.P.
InventorsPei-Ju Lin, Chang-Hsien Chen, Bhyrav Mutnury, Yi-Tang Chen
Life of this patent
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Abstract
A printed circuit board comprising a differential microstrip pair including a neck-down area and an ultraviolet glue coating a portion of the neck-down area of the differential microstrip pair to control an impedance of the differential microstrip pair.
Claims20
A printed circuit board comprising:
- a differential microstrip pair including a neck-down area;
- and
- an ultraviolet glue coating a portion of the neck-down area of the differential microstrip pair to control an impedance of the differential microstrip pair, wherein the ultraviolet glue coating is applied over a solder mask layer.
An information handling system, comprising:
- a processor;
- and
- a printed circuit board further comprising:
- a differential microstrip pair including a neck-down area;
- and
- an ultraviolet glue coating a portion of the neck-down area of the differential microstrip pair to control impedance of the differential microstrip pair, wherein an area of the ultraviolet glue coating is less than the neck-down area of the differential microstrip pair.
3 more elements
A method comprising:
- providing a differential microstrip pair including a neck-down area;
- and
- providing an ultraviolet glue coating a portion of the neck-down area of the differential microstrip pair to control impedance of the differential microstrip pair, wherein the ultraviolet glue coating is applied over a solder mask layer.
Dependencies are inferred from the claim text.