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US 12,567,515 B2Granted
Conductive film, touch panel, photosensitive resin composition, and method of manufacturing conductive film
AssigneeFUJIFILM Corporation
InventorsDaigo Sawaki, Kazuhiro Hasegawa
Life of this patent
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Abstract
In a conductive film, a cured film formed of a photosensitive resin composition including at least one of monomers represented by Formulae (1) and (2), a clay mineral, and a photopolymerization initiator is provided as a protective layer of a lead-out wiring part of the conductive film that functions as a touch sensor.
Claims15
A conductive film comprising:
- a fine metal wire that is provided on at least one surface of a transparent flexible substrate,
- wherein at least a part of the fine metal wire is covered with a protective layer obtained by curing a photosensitive resin composition including a resin forming component that includes at least one of (meth)acrylate monomers represented by Formulae (1) and (2), a clay mineral, and a photopolymerization initiator,
- a thickness (t) of the protective layer is 15 μm or less,
- an average particle diameter (Dave) of the clay mineral is ⅕ to ½ the thickness (t) of the protective layer and an average aspect ratio of the clay mineral is 2.0 or more,
- a proportion of the clay mineral having a particle diameter that is more than or equal to the thickness (t) of the protective layer is 0.5 vol % or less, and
- a proportion of the clay mineral in the photosensitive resin composition is 5 to 50 mass %,
- R1 and R2 each independently represent a (meth)acryloyl group, R3 represents an unsubstituted or (meth)acryloyl group, and X represents a single bond or a divalent linking group represented by Formula (3),
- —Y1—R4—Y2— Formula (3)
- R4 represents an alkylene group having 3 or less carbon atoms, and Y1 and Y2 each independently represent an oxygen atom or a single bond.
6 more elements
A conductive film comprising:
- a fine metal wire that is provided on at least one surface of a transparent flexible substrate,
- wherein a protective layer including a resin component having a dicyclopentenyl structure or a tricyclodecane structure and a clay mineral is laminated on at least a part of the fine metal wire,
- a thickness (t) of the protective layer is 15 μm or less,
- an average particle diameter (Dave) of the clay mineral is ⅕ to ½ the thickness (t) of the protective layer and an average aspect ratio of the clay mineral is 2.0 or more,
- a proportion of the clay mineral having a particle diameter that is more than or equal to the thickness (t) of the protective layer is 0.5 vol % or less, and
- a proportion of the clay mineral in the protective layer is 5 to 50 mass %.
3 more elements
A photosensitive resin composition comprising:
- a resin forming component that includes at least one of (meth)acrylate monomers represented by Formulae (1) and (2);
- a clay mineral that has an average particle diameter (Dave) of 7.5 μm or less and an average aspect ratio of 2.0 or more and is surface-modified with a silane coupling agent having a functional group crosslinkable with the resin forming component;
- and
- a photopolymerization initiator,
- wherein a viscosity of the photosensitive resin composition is 5000 mPa·s or higher, and
- a proportion of the clay mineral in the photosensitive resin composition is 5 to 50 mass %,
- R1 and R2 each independently represent a (meth)acryloyl group, R3 represents an unsubstituted or (meth)acryloyl group, and X represents a single bond or a divalent linking group represented by Formula (3),
- —Y1—R4—Y2— Formula (3)
- R4 represents an alkylene group having 3 or less carbon atoms, and Y1 and Y2 each independently represent an oxygen atom or a single bond.
6 more elements
Dependencies are inferred from the claim text.