Higher-layer-processing data in time-sensitive data blocks at a physical-layer-interface device
AssigneeMicrochip Technology Incorporated
InventorsBrian Branscomb, William Mahany, Sailesh Rupani
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AssigneeMicrochip Technology Incorporated
InventorsBrian Branscomb, William Mahany, Sailesh Rupani
Estimating the term…
Examples of the present disclosure relate generally to implementing higher-layer processing on time-sensitive data blocks at a physical-layer-interface device. Some examples include logic to perform operations, the operations including providing data blocks to a physical-layer-interface device. The operations may also include adding dummy data into one or more time-sensitive data blocks of the data blocks being provided to the physical-layer-interface device. A size of the dummy data corresponding to a size of higher-layer-processing data. Other example operations may include removing higher-layer-processing data from a first ingressing data block. The other operations may also include removing a portion of the first ingressing data block and adding the portion to a subsequent ingressing data block. A size of the portion corresponding to the size of integrity-detection data. The other operations may also include removing the integrity-detection data from an ingressing data block. Related methods, systems, and devices are also disclosed.
An apparatus comprising:
A method comprising:
An apparatus, comprising:
A method, comprising:
Dependencies are inferred from the claim text.