Apparatus for treating substrate including first substrate treating apparatus and transfer system
AssigneeSemes Co., Ltd.
InventorsSung-Gyu Lee, Jung-Hyun Lee, Hye Bin Baek, Dae Woon Lee, Dongwoon Park
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Abstract
Disclosed is an apparatus for treating a substrate, which includes: a first unit configured to perform a coating process of forming a film on a substrate; a transfer unit including a transfer robot transferring a substrate for which the coating process is terminated; and a controller controlling the first unit and the transfer unit, in which the controller controls the substrate for which the coating process is terminated in the first unit to rotate at a first rotational velocity until the substrate is transferred by the transfer unit.
Claims9
An apparatus for treating a substrate, the apparatus comprising:
- a first substrate treating apparatus configured to perform a coating process of forming a film on a substrate;
- a transfer system including a transfer robot configured to transfer a substrate once the coating process is terminated;
- and
- a controller configured to control the first substrate treating apparatus and the transfer system to rotate the substrate at a first rotational velocity, once the coating process is terminated, until the substrate is transferred by the transfer system
- the controller being configured to control rotation of the substrate at the first rotational velocity to be stopped when the transfer robot is located at a set position, and
- the first substrate treating apparatus including a process chamber defining an inner space in which the coating process is performed, and having a door configured to allow the substrate to be carried in and over on one side wall, and
- the set position being a position where the transfer robot is positioned in front of the door.
An apparatus for treating a substrate, the apparatus comprising:
- a first substrate treating apparatus configured to perform a coating process of forming a film on a rotating substrate;
- a second substrate treating apparatus configured to perform a heat treating process on the substrate;
- a transfer system including a transfer robot configured to transfer the substrate between the first substrate treating apparatus and the second substrate treating apparatus;
- and
- a controller configured to control the first substrate treating apparatus, the second substrate treating apparatus, and the transfer system to
- rotate the substrate at a first rotational velocity, once the the coating process is terminated, until the substrate is transferred by the transfer system and the transfer robot is located at a set position
- the controller being configured to control the coating process to
- form the film on the substrate by supplying a photosensitive liquid to a substrate that rotates at a second rotational velocity, and
- remove a first portion of a film of an edge region of the substrate by supplying a thinner liquid to the substrate that rotates at a third rotational velocity, and
- the first rotational velocity being lower than the third rotational velocity, and the third rotational velocity being lower than the second rotational velocity, and
- the set position being a position where the transfer robot is positioned in front of a door of a process chamber in which the coating process is performed.
Dependencies are inferred from the claim text.