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US 12,566,296 B2Granted
Optical module having multiple laser diode devices and a support member
AssigneeKYOCERA SLD Laser, Inc.
InventorsEric Goutain, James W. Raring, Paul Rudy, Hua Huang
Life of this patent
Estimating the term…
Abstract
A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.
Claims20
A system comprising:
- a package having an optical module apparatus configured for use with an application selected from white lighting applications, multi-colored lighting applications, flat panel applications, medical applications, metrology applications, beam projector applications, display applications, high intensity lamp applications, spectroscopy applications, entertainment applications, theater applications, music applications, concert applications, analysis fraud detection applications, authenticating applications, tool applications, water treatment applications, laser dazzler applications, targeting applications, communications applications, transformation applications, transportation applications, leveling applications, curing applications, chemical treatment applications, heating applications, cutting applications, ablating applications, pumping applications, optical device applications, optoelectronic device applications, source lighting applications, power scaling applications, spectral broadening applications, or multicolor monolithic integration applications, the optical module apparatus comprising:
- a plurality of ceramic support members;
- a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips, each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam;
- wherein at least one of the plurality of laser diode chips comprises a gallium and nitrogen containing laser diode device configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, or green emission with a wavelength ranging from 500 nm to 560 nm;
- one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine or collimate the laser beams to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- and
- a power source electrically coupled to the plurality of laser diode chips;
- wherein:
- the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
- the one or more optical devices comprise free space optics configured to create one or more free space optical beams;
- a thermal path from each of the plurality of laser diode chips to the heat sink is characterized by a thermal impedance;
- and
- the optical module apparatus is characterized by an optical output power of at least 5 W.
10 more elements
A system comprising:
- a package having an optical module apparatus configured for use with an application, the optical module apparatus comprising:
- a plurality of ceramic support members;
- a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips;
- each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam;
- wherein at least one of the laser diode chips comprises gallium and nitrogen and is configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, green emission with a wavelength ranging from 500 nm to 560 nm, and a combination thereof;
- one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine and/or collimate the laser beams;
- the laser beams characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- wherein the one or more optical devices comprise free space optics configured to create one or more free space optical beams;
- an optical fiber configured to receive the laser beams from the plurality of laser diode chips by optical coupling;
- and to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- wherein:
- the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
- and
- the output beam is characterized by an optical output power of at least 5 W.
11 more elements
A system comprising:
- an optical module apparatus configured for use with an application;
- and
- a package configured to enclose the optical module apparatus, the optical module apparatus comprising:
- a plurality of ceramic support members;
- a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips;
- each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam;
- wherein at least one of the laser diode chips comprises a gallium and nitrogen containing laser diode device configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, or green emission with a wavelength ranging from 500 nm to 560 nm;
- one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine or collimate the laser beams to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- and
- a power source electrically coupled to the plurality of laser diode chips;
- wherein:
- the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
- the one or more optical devices comprise free space optics configured to create one or more free space optical beams;
- a thermal path from each of the plurality of laser diode chips to the heat sink is characterized by a thermal impedance;
- and
- the optical module apparatus is characterized by an optical output power of 5 W or greater.
13 more elements
A system comprising:
- an optical module apparatus configured for use with an application;
- and
- a package configured to enclose the optical module apparatus, the optical module apparatus comprising:
- a plurality of ceramic support members;
- a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips;
- each of the plurality of laser diode chips having a single laser diode;
- each of the plurality of laser diode chips overlying one of the plurality of ceramic support members, each of the laser diode chips configured to emit a laser beam;
- wherein at least one of the laser diode chips comprises gallium and nitrogen and is configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, green emission with a wavelength ranging from 500 nm to 560 nm, and a combination thereof;
- one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine and/or collimate the laser beams;
- the laser beams characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- wherein the one or more optical devices comprise free space optics configured to create one or more free space optical beams;
- an optical fiber configured to receive the laser beams from the plurality of laser diode chips by optical coupling;
- and to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
- wherein:
- the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
- and
- the output beam is characterized by an optical output power of at least 5 W.
14 more elements
Dependencies are inferred from the claim text.