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AssigneeElectronics and Telecommunications Research Institute
InventorsDae Seon Kim, Jong Jin Lee
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The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.
An attachment/detachment apparatus of a surface mount type optical module (hereinafter, referred to as an ‘optical module’), the apparatus comprising:
A method for attaching or detaching a surface mount type optical module (hereinafter, referred to as an ‘optical module’) to and from a board by using an attachment/detachment apparatus, the method comprising:
A method for attaching or detaching a surface mount type optical module (hereinafter, referred to as an ‘optical module’) to and from a board by using an attachment/detachment apparatus, the method comprising:
Dependencies are inferred from the claim text.