High-frequency dielectric heating adhesive sheet

A high-frequency dielectric heating adhesive sheet comprising:

• a first adhesive layer;
• a second adhesive layer;
• and
• an intermediate layer located between the first adhesive layer and the second adhesive layer,
• the first adhesive layer comprising a first thermoplastic resin,
• the second adhesive layer comprising a second thermoplastic resin, wherein
• each of dielectric property DP1 of the first adhesive layer and dielectric property DP2 of the second adhesive layer is 0.005 or more,
• dielectric property DPM of the intermediate layer is less than 0.005,
• at least one of the first adhesive layer or the second adhesive layer further comprises a dielectric filler that generates heat in response to a high-frequency wave,
• the dielectric filler in the at least one of the first adhesive layer or the second adhesive layer comprises at least one selected from the group consisting of zinc oxide and silicon carbide,
• the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε′r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively,
• tanδ denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz, and
• ε′r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.