Resin composition, self-fusing insulated electric wire and wire bundle
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Wintec, Inc.
InventorsHideaki Saito, Shigenori Homma, Jun Sugawara
Life of this patent
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Abstract
A resin composition includes a phenoxy resin as a principal component. The phenoxy resin has a weight-average molecular weight of 40,000 or more. The phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy and a second structural unit derived from a bisphenol epoxy other than the first structural unit. A content ratio of the first structural unit in the phenoxy resin is 20 mol % to 80 mol % relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.
Claims11
A resin composition comprising
- 60 to 85 mass % of a phenoxy resin, and
- 15 to 40 mass % of at least one additional component comprising a blowing agent,
- wherein
- the phenoxy resin has a weight-average molecular weight of 40,000 or more,
- the phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy, a second structural unit derived from a bisphenol A epoxy and a bisphenol F epoxy, and
- a content ratio of the first structural unit in the phenoxy resin is 20 mol % to 80 mol % relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.
Dependencies are inferred from the claim text.