Different material bonding apparatus and operation method thereof
AssigneeHl Klemove Corp.
InventorMinha Lee
Life of this patent
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Abstract
Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second layer, the second layer includes a plurality of penetration grooves formed to be recessed in the one surface contacting the first layer, and a melting point of the second layer is higher than a melting point of the first layer.
Claims10
A bonding apparatus comprising:
- an upper layer having a first surface, a second surface opposite to the first surface, and lateral surfaces extending between the first and second surfaces;
- a lower layer having a third surface facing the first surface, a fourth surface facing away from the first surface, and end portions;
- and
- a heater,
- wherein
- the lower layer has a melting point higher than a melting point of the upper layer,
- the end portions are formed integrally and bent upwardly to cover and be in contact with the lateral surfaces of the upper layer, and
- the heater is configured to apply heat to lateral outer surfaces of the end portions.
A bonding apparatus comprising:
- an upper layer having a first surface, a second surface opposite to the first surface, and lateral surfaces extending between the first and second surfaces;
- a lower layer having a third surface facing the first surface, a fourth surface facing away from the first surface, and end portions;
- and
- a heater,
- wherein
- the lower layer has a melting point higher than a melting point of the upper layer,
- the end portions are formed integrally and bent upwardly to cover and be in contact with the lateral surfaces and edge regions of the second surface in a C-shaped configuration around the upper layer, and
- the heater is configured to apply heat to top outer surfaces of the end portions.
Dependencies are inferred from the claim text.