Structured discrete beam formation for cutting transparent substrates

A method comprising:

• emitting an ultra-short pulse laser beam from a laser source;
• forming the laser beam into a plurality of discrete beams via an optical array, wherein intersecting discrete beams form a structured light pattern comprising a plurality of voxels at intersections of the intersecting discrete beams, a first subset of the plurality of voxels defining a line and a second subset of the plurality of voxels lying outside the line;
• forming a plurality of voids in a substrate by aligning the structured light pattern onto the substrate, each voxel of the plurality of voxels of the aligned structured light pattern forming a discrete void in the substrate, each void separated by unmodified portions of the substrate, wherein the intersecting discrete beams intersect within the substrate to form the plurality of voids at the plurality of voxels;
• and
• after forming the plurality of voids in the substrate at a plurality of different positions, forming an article by separating one portion of the substrate from a base portion of the substrate.