Method for producing sputtering target material
AssigneeSanyo Special Steel Co., Ltd.
InventorNoriaki Matsubara
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AssigneeSanyo Special Steel Co., Ltd.
InventorNoriaki Matsubara
Estimating the term…
Provided is a method of producing a target material with reduced particle generation during sputtering, which is a method of producing a sputtering target material whose material is an alloy M, including a sintering step of sintering a mixed powder obtained by mixing a first powder and a second powder. A material of the first powder is an alloy M1 in which the proportion of a B content is from 40 at. % to 60 at. %. A material of the second powder is an alloy M2 in which the proportion of a B content is from 20 at. % to 35 at. %. The proportion of a B content in the mixed powder is from 33 at. % to 50 at. %. A metallographic structure including a (CoFe)2B phase and a (CoFe)B phase is formed in the sintering step. A boundary length per unit area Y (1/μm), which is obtained by measuring a boundary length between the (CoFe)2B phase and the (CoFe)B phase using a scanning electron microscope, and a proportion X (at. %) of a B content of the alloy M satisfy the expression Y<−0.0015×(X−42.5)2+0.15.
A method of producing a sputtering target material composed of an alloy M comprising B, and Co and/or Fe, with a balance consisting of inevitable impurities, the method comprising a sintering step of sintering a mixed powder obtained by mixing a first powder and a second powder,
Dependencies are inferred from the claim text.