Semiconductor device and method for diagnosing deterioration of semiconductor device
AssigneeMitsubishi Electric Corporation
InventorYumie Kitajima
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Abstract
Provided is a technique for enhancing the accuracy of deterioration diagnosis in a semiconductor device. The semiconductor device relating to the technique disclosed in the present specification is provided with a case, a semiconductor chip inside the case, a metal wire bonded to an upper surface of the semiconductor chip, at least one test piece inside the case, and a pair of terminals provided outside the case and connected to the test piece. The test piece is separated from the metal wire inside the case.
Claims18
A semiconductor device comprising:
- a case;
- a semiconductor chip inside the case;
- a metal wire bonded to an upper surface of the semiconductor chip;
- at least one metal test piece inside the case for deterioration observation of the semiconductor device;
- and
- a pair of terminals provided outside the case, each side of the test piece being directly connected to a respective terminal of the pair of terminals;
- and
- an electrode pattern bonded to a lower surface of the semiconductor chip, wherein
- the test piece is separated from the metal wire inside the case, and
- at least one of the pair of terminals is also connected to the electrode pattern.
A method for diagnosing deterioration of a semiconductor device by using at least one test piece inside a case, wherein
- the test piece is separated from a metal wire bonded to an upper surface of a semiconductor chip inside the case,
- the method comprising
- diagnosing deterioration of the semiconductor device including the semiconductor chip by determining a fluctuation amount of a resistance measured across a pair of terminals provided outside the case and connected to the test piece, each side of the test piece being directly connected to a respective terminal of the pair of terminals, wherein
- an electrode pattern is bonded to a lower surface of the semiconductor chip, and at least one of the pair of terminals is also connected to the electrode pattern.
A semiconductor device comprising:
- a case;
- a semiconductor chip inside the case;
- a metal wire bonded to an upper surface of the semiconductor chip;
- at least one metal test piece for deterioration observation of the semiconductor chip inside the case;
- and
- a pair of terminals provided outside the case, each side of the test piece being directly connected to a respective terminal of the pair of terminals, wherein
- the test piece is separated from the metal wire inside the case
- the test piece is configured with a plurality of metal pieces that are insulated from each other.
Dependencies are inferred from the claim text.