Double-sided integrated circuit module having an exposed semiconductor die
AssigneeQorvo US, Inc.
InventorsJohn Robert Siomkos, Edward T. Spears, Mark Crandall
Life of this patent
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Abstract
The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.
Claims17
A method for assembling a radio frequency (RF) module, comprising:
- coupling an electronic component configured for RF operation to a top side of a module substrate;
- encapsulating the electronic component in a first mold compound;
- coupling a semiconductor die to a bottom side of the module substrate, wherein coupling the semiconductor die to the bottom side of the module substrate further comprises coupling a plurality of conductive elements between the semiconductor die and the bottom side of the module substrate;
- attaching a plurality of solder balls at the bottom side of the module substrate;
- encapsulating the semiconductor die and the plurality of solder balls in a second mold compound such that the second mold compound at least partially surrounds the semiconductor die;
- and
- removing a portion of the second mold compound to expose a surface of the semiconductor die and each of the plurality of solder balls which extend from the bottom side of the module substrate to below the surface of the semiconductor die, and wherein removing the portion of the second mold compound forms a planar bottom module surface defined by the second mold compound and the surface of the semiconductor die.
A method for assembling a radio frequency (RF) module, comprising:
- coupling an electronic component configured for RF operation to a top side of a module substrate;
- encapsulating the electronic component in a first mold compound;
- coupling a semiconductor die to a bottom side of the module substrate;
- attaching a plurality of solder balls at the bottom side of the module substrate;
- encapsulating the semiconductor die and the plurality of solder balls in a second mold compound such that the second mold compound at least partially surrounds the semiconductor die;
- removing a portion of the second mold compound to expose a surface of the semiconductor die and each of the plurality of solder balls which extend from the bottom side of the module substrate to below the surface of the semiconductor die, wherein removing the portion of the second mold compound forms a planar bottom module surface defined by the second mold compound and the surface of the semiconductor die;
- and
- coupling a heat exchanger to the planar bottom module surface such that the heat exchanger is configured to exchange heat with the semiconductor die.
Dependencies are inferred from the claim text.