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US 12,564,083 B2Granted
Packaging structure having semiconductor chips and encapsulation layers and formation method thereof
AssigneesNantong Tongfu Microelectronics Co., Ltd, Tongfu Microelectronics Co., Ltd.
InventorsLei Shi, Yujuan Tao, Ying Dai
Life of this patent
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Abstract
A packaging structure and a formation method thereof are provided. The packaging structure includes a carrier board, and a plurality of semiconductor chips adhered to the carrier board. Each semiconductor chip has a functional surface and a non-functional surface opposite to the functional surface, and a plurality of pads are formed on the functional surface of a semiconductor chip of the plurality of chips. A metal bump is formed on a surface of a pad of the plurality of pads, and a first encapsulation layer is formed on the functional surface. The packaging structure also includes a second encapsulation layer formed over the carrier board.
Claims20
A packaging structure, comprising:
- a carrier board;
- a plurality of semiconductor chips, adhered to the carrier board, wherein each semiconductor chip has a functional surface and a non-functional surface opposite to the functional surface, a plurality of pads are formed on the functional surface of a semiconductor chip of the plurality of semiconductor chips, a metal bump is formed on a surface of a pad of the plurality of pads, and a first encapsulation layer is formed on the functional surface;
- and
- a second encapsulation layer, formed over the carrier board,
- wherein an interface between a first surface of the first encapsulation layer and the functional surface of the semiconductor chip is coplanar with an interface between a first surface of the metal bump and the pad on which the metal bump is formed, and
- wherein a second surface of the first encapsulation layer protrudes over a second surface of the metal bump, providing a first opening between sidewalls of the first encapsulation layer and exposing the second surface of the metal bump at a bottom of the first opening.
3 more elements
A method for forming a packaging structure, comprising:
- providing a plurality of semiconductor chips, wherein each semiconductor chip of the plurality of semiconductor chips includes a functional surface and a non-functional surface opposite to the functional surface, a plurality of pads are formed on the functional surface, a metal bump is formed on a surface of a pad of the plurality of pads, an isolation sacrificial layer is formed on the metal bump, and a first encapsulation layer is formed on the functional surface and envelops both the isolation sacrificial layer and the metal bump;
- providing a carrier board;
- adhering the first encapsulation layer on the functional surface of the each semiconductor chip to the carrier board;
- forming a second encapsulation layer on the carrier board to cover the non-functional surface and a sidewall surface of a semiconductor chip of the plurality of semiconductor chips;
- forming a pre-encapsulation panel by peeling off the carrier board, wherein a back side of the pre-encapsulation panel exposes the first encapsulation layer;
- removing a portion of the first encapsulation layer and the second encapsulation layer on the back side of the pre-encapsulation panel, followed by removing the isolation sacrificial layer to expose a surface of the metal bump at the back side of the pre-encapsulation panel, wherein
- an interface between a first surface of the first encapsulation layer and the functional surface of the semiconductor chip is coplanar with an interface between a first surface of the metal bump and the pad on which the metal bump is formed, and
- a second surface of the first encapsulation layer protrudes over the exposed surface of the metal bump, providing a first opening between sidewalls of the first encapsulation layer with the exposed surface of the metal bump at a bottom of the first opening, wherein
- the metal bump on the back side of the pre-encapsulation panel is configured to electrically connect to an external contact structure.
6 more elements
A method for forming a packaging structure, comprising:
- providing a plurality of semiconductor chips, wherein each semiconductor chip of the plurality of semiconductor chips includes a functional surface and a non-functional surface opposite to the functional surface, a plurality of pads are formed on the functional surface, a metal bump is formed on a surface of a pad of the plurality of pads, an isolation sacrificial layer is formed on the metal bump, and a first encapsulation layer is formed on the functional surface and envelops both the isolation sacrificial layer and the metal bump;
- providing a carrier board;
- adhering the non-functional surface of the each semiconductor chip to the carrier board;
- forming a second encapsulation layer on the carrier board to cover the first encapsulation layer on the functional surface, and a sidewall surface of a semiconductor chip of the plurality of semiconductor chips;
- removing a portion of the first encapsulation layer and the second encapsulation layer over the carrier board by a planarization process, followed by removing the isolation sacrificial layer to expose a surface of the metal bump, wherein
- an interface between a first surface of the first encapsulation layer and the functional surface of the semiconductor chip is coplanar with an interface between a first surface of the metal bump and the pad on which the metal bump is formed, and
- a second surface of the first encapsulation layer protrudes over the exposed surface of the metal bump, providing a first opening between sidewalls of the first encapsulation layer with the exposed surface of the metal bump at a bottom of the first opening;
- forming an external contact structure connected to the metal bump on a surface of the planarized first encapsulation layer and the second encapsulation layer;
- and
- peeling off the carrier board.
7 more elements
Dependencies are inferred from the claim text.