Method of forming package structure including antennas

A method, comprising:

• forming a first conductive pattern and a second conductive pattern on a carrier, wherein the first conductive pattern is physically separated from the second conductive pattern;
• bonding a semiconductor die to the first conductive pattern through a die attach film, wherein fillers inside the die attach film are directly contacting a top surface of the first conductive pattern, and directly contacting a backside surface of the semiconductor die;
• forming through insulator vias on the second conductive pattern and laterally surrounding the semiconductor die;
• and
• debonding the carrier, and forming a molding compound over a bottom surface of the first conductive pattern after debonding the carrier;
• and
• forming a plurality of antenna patterns on a surface of the molding compound and over the bottom surface of the first conductive pattern, wherein the plurality of antenna patterns is partially overlapped with the semiconductor die, the through insulator vias, the first conductive pattern and the second conductive pattern.

A method, comprising:

• forming a buffer layer on a carrier;
• forming a first conductive pattern and a second conductive pattern on the buffer layer, wherein the second conductive pattern comprises an inner surface and an outer surface, and the first conductive pattern is surrounded by the inner surface of the second conductive pattern;
• forming an insulating encapsulant on the buffer layer, wherein the insulating encapsulant is encapsulating the first conductive pattern and the second conductive pattern;
• and
• debonding the carrier and forming antenna patterns on the buffer layer, wherein the antenna patterns are overlapped with four inner corners on the inner surface of the second conductive pattern.