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US 12,564,069 B2Granted
Semiconductor apparatus, authenticity determination method and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorsYoshihisa Uchida, Tatsunori Yanagimoto
Life of this patent
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Abstract
According to the present disclosure, a semiconductor apparatus comprises a housing a semiconductor chip installed in the housing, and a first radio tag installed on the housing. The first radio tag is installed in a state where rewriting from outside is not limited.
Claims18
A semiconductor apparatus, comprising:
- a housing;
- sealing material filling the housing;
- a semiconductor chip installed in the housing, surrounded by the housing, and sealed by sealing the sealing material;
- and
- a first radio tag separate from the semiconductor chip and installed on the housing,
- the first radio tag being installed in a state where rewriting from outside is not limited,
- wherein the semiconductor chip includes a main electrode and a signal electrode formed on a surface,
- the semiconductor apparatus comprises
- a main terminal connected to the main electrode, and
- a signal terminal connected to the signal electrode, and
- the first radio tag is installed at a position closer to the signal terminal than the main terminal.
8 more elements
A semiconductor apparatus, comprising:
- a sealing material made of an insulation resin;
- a metal frame at least partially arranged inside the sealing material;
- a semiconductor chip arranged on the metal frame;
- and
- a first radio tag separate from the semiconductor chip and arranged on a surface of the metal frame,
- the first radio tag being installed in a state where rewriting from outside is not limited,
- wherein the semiconductor chip includes a main electrode and a signal electrode formed on a surface,
- the semiconductor apparatus comprises
- a main terminal connected to the main electrode, and
- a signal terminal connected to the signal electrode, and
- the first radio tag is installed at a position closer to the signal terminal than the main terminal.
8 more elements
A semiconductor apparatus, comprising:
- a housing;
- sealing material filling the housing;
- a semiconductor chip installed in the housing, surrounded by the housing, and sealed by sealing the sealing material;
- and
- a radio tag separate from the semiconductor chip and installed on the housing,
- the radio tag being configured to store individual identification information of the semiconductor apparatus and being installed in a state where rewriting from outside is limited,
- wherein the semiconductor chip includes a main electrode and a signal electrode formed on a surface,
- the semiconductor apparatus comprises
- a main terminal connected to the main electrode, and
- a signal terminal connected to the signal electrode, and
- the radio tag is installed at a position closer to the signal terminal than the main terminal.
8 more elements
A semiconductor apparatus, comprising:
- a sealing material made of an insulation resin;
- a metal frame at least partially arranged inside the sealing material;
- a semiconductor chip arranged on the metal frame;
- and
- a radio tag separate from the semiconductor chip and arranged on a surface of the metal frame,
- the radio tag being configured to store individual identification information of the semiconductor apparatus and being installed in a state where rewriting from outside is limited,
- wherein the semiconductor chip includes a main electrode and a signal electrode formed on a surface,
- the semiconductor apparatus comprises
- a main terminal connected to the main electrode, and
- a signal terminal connected to the signal electrode, and
- the radio tag is installed at a position closer to the signal terminal than the main terminal.
8 more elements
Dependencies are inferred from the claim text.