Diagnostic device, semiconductor manufacturing equipment system, semiconductor equipment manufacturing system, and diagnostic method

A semiconductor equipment manufacturing system to which a semiconductor manufacturing apparatus is connected, comprising:

• a platform comprising a processor and a memory storing programmed instructions which, when executed by the processor, cause the platform to perform operations for diagnosing a state of the semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus includes a processing chamber in which a sample is processed, a transfer unit that is connected to the processing chamber and transfers the sample to the processing chamber, a valve that is disposed between the processing chamber and the transfer unit, an exhaust unit connected to the processing chamber via an exhaust pipe for exhausting the processing chamber, a first pressure gauge connected to the exhaust pipe and configured to measure a first pressure value of the exhaust pipe, and a second pressure gauge connected to the transfer unit and configured to measure a second pressure value of the transfer unit,
• wherein the platform further comprises an external interface circuit connected to the semiconductor manufacturing apparatus via a network, and
• wherein the processor is configured to
• receive the first pressure value and the second pressure value from the semiconductor manufacturing apparatus via the external interface at a first time;
• receive the first pressure value and the second pressure value from the semiconductor manufacturing apparatus again via the external interface at a second time which is later than the first time by a predetermined period after the valve is opened;
• and
• determine wherein whether or not there is an anomaly in the exhaust unit or the exhaust pipe regarding the exhaust unit on the basis of the first pressure value at the second time regarding the exhaust unit during the predetermined period after the valve is opened.

A diagnostic method for diagnosing a state of a semiconductor manufacturing apparatus that includes a processing chamber in which a sample is processed, a transfer unit that is connected to the processing chamber and transfers the sample to the processing chamber, a valve that is disposed between the processing chamber and the transfer unit, an exhaust unit connected to the processing chamber via an exhaust pipe for exhausting the processing chamber, a first pressure gauge connected to the exhaust pipe and configured to measure a first pressure value of the exhaust pipe, and a second pressure gauge connected to the transfer unit and configured to measure a second pressure value of the transfer unit, the method comprising:

• receiving the first pressure value and the second pressure value from the semiconductor manufacturing apparatus via the external interface at a first time;
• receiving the first pressure value and the second pressure value from the semiconductor manufacturing apparatus again via the external interface at a second time which is later than the first time by a predetermined period after the valve is opened;
• and
• determining whether or not there is an anomaly in the exhaust unit or the exhaust pipe regarding the exhaust unit on the basis of the first pressure value at the second time regarding the exhaust unit during the predetermined period after the valve is opened.