Integrated RC architecture, and methods of fabrication thereof

An integrated RC component comprising:

• a substrate including a first surface on a first side and a second surface on a second side, the second side of the substrate opposite to the first side, the second side located below first side, wherein the first surface and the second surface are on separate flat planes, wherein the second surface is uniformly flat;
• a capacitor having a thin-film top electrode portion at the first surface on the first side of the substrate;
• an insulating layer arranged above the thin-film top electrode portion of the capacitor;
• a contact plate provided above and around the insulating layer;
• a set of plural bridging contacts traversing the insulating layer and electrically connecting the thin-film top electrode portion of the capacitor to the contact plate, the bridging contacts being evenly distributed across a surface of the thin-film top electrode portion of the capacitor in a grid formation;
• and
• first and second contacts arranged, respectively, on the first side of the substrate and on the second side of the substrate opposite to said first side, wherein the second contact is located below the second side and on the second surface of the substrate,
• wherein the first contact comprises the contact plate, and a series RC circuit is formed between the first and second contacts.