# US 12,563,660 B2 · Circuit board and electronic device comprising same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,563,660 B2 - Document ID: US12563660B2 - Status: Granted - Kind: B2 - Application number: 18/348,003 - Filed: 2023-07-06 - Published: 2023-11-09 - Granted: 2026-02-24 - Earliest claimed: 2021-01-06 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Byeongkeol Kim; Eunseok Hong; Youngsun Lee - Web page: https://patentgrep.com/patent/US12563660B2 ## CPC - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - G06F 1/1616: {with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position} - G06F 1/1624: {with sliding enclosures, e.g. sliding keyboard or display} - G06F 1/1652: {the display being flexible, e.g. mimicking a sheet of paper, or rollable} - H01P 3/085: {Triplate lines} - H04B 1/0053: {with common antenna for more than one band} - H04M 1/026: {Details of the structure or mounting of specific components} - H04M 1/0277: {for a printed circuit board assembly} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H04M 1/0214: {Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position (combined with translation movement H04M1/0235)} - H04M 1/0235: {Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material - H05K 2201/096: Vertically aligned vias, holes or stacked vias - H05K 2201/09636: Details of adjacent, not connected vias - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2203/107: Using laser light - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H04B: TRANSMISSION - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) ## Abstract An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay. ## Claims ### Claim 1 An electronic device comprising: a housing comprising a first housing part and a second housing part configured to be movable relative to the first housing part; and a circuit board which is positioned in the housing and comprises a first portion bent in response to a movement of the second housing part, and a second portion which extends from the first portion and is more rigid than the first portion, wherein the circuit board comprises: a flexible dielectric extending from the first portion to the second portion, a first ground pattern extending from the first portion to the second portion and disposed on the flexible dielectric, a second ground pattern positioned in the second portion, a coverlay extending from the first portion to the second portion and comprising an electromagnetic shielding layer, a portion of the coverlay positioned between the first ground pattern and the second ground pattern at the second portion, and a first conductive via positioned in the second portion and configured to electrically connect to the first ground pattern, the second ground pattern, and the coverlay, a first signal line pattern extending from the first portion to the second portion, disposed on the flexible dielectric, a second signal line pattern positioned in the second portion, and a second conductive via positioned in the second portion and configured to electrically connect to the first signal line pattern and the second signal line pattern, wherein the second conductive via is configured to penetrate the coverlay and to be electrically isolated from the electromagnetic shielding layer of the coverlay. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the portion of the coverlay is disposed inside the second portion. ### Claim 3 (depends on 2) The electronic device of claim 2, wherein another portion of the coverlay forms a part of a surface of the circuit board. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein the coverlay further comprises: a first insulation layer extending from the first portion to the second portion, and forming a part of a surface of the circuit board, and a second insulation layer extending from the first portion to the second portion, and positioned between the first insulation layer and the flexible dielectric, and wherein the electromagnetic shielding layer is disposed between the first insulation layer and the second insulation layer, wherein the at least one first conductive via electrically connects the first ground pattern, the second ground pattern, and the conductive electromagnetic shielding layer of the coverlay. ### Claim 5 (depends on 4) The electronic device of claim 4, wherein the coverlay further comprises a non-conductive adhesive layer disposed on the second insulation layer, and wherein the second insulation layer is disposed between the electromagnetic shielding layer and the non-conductive adhesive layer. ### Claim 6 (depends on 4) The electronic device of claim 4, wherein the second insulation layer has a thickness greater than the electromagnetic shielding layer or the first insulation layer. ### Claim 7 (depends on 1) The electronic device of claim 1, wherein the at least one first conductive via comprises a laser via hole (LVH) or a stacked via. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the second conductive via is configured to penetrate the coverlay through a hole formed in the coverlay, and wherein the circuit board comprises a non-conductive member disposed between the second conductive via and an inner surface of the hole such that the second conductive via is physically and electrically separated from the coverlay. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the second conductive via comprises a plated through hole (PTH). ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the second portion has a thickness greater than the first portion. ### Claim 11 (depends on 1) The electronic device of claim 1, wherein the second portion protrudes with respect to the first portion. ### Claim 12 (depends on 1) The electronic device of claim 1, wherein the second portion further comprises a rigid dielectric compared to the first portion. ### Claim 13 (depends on 1) The electronic device of claim 1, wherein the circuit board is configured to electrically connect a first electrical element positioned in the first housing part and a second electrical element positioned in the second housing part, wherein the first electrical element comprises at least one antenna, and wherein the second electrical element comprises a wireless communication circuit configured to transmit or receive a signal of a selected or a designated frequency band through the at least one antenna. ### Claim 14 A circuit board comprising: a first portion, and a second portion which extends from the first portion and is more rigid than the first portion; a flexible dielectric extending from the first portion to the second portion, a first ground pattern extending from the first portion to the second portion and disposed on the flexible dielectric; a second ground pattern positioned in the second portion; a coverlay extending from the first portion into the second portion and comprising an electromagnetic shielding layer, a portion of the coverlay positioned between the first ground pattern and the second ground pattern at the second portion; and a first conductive via positioned in the second portion and configured to electrically connect to the first ground pattern, the second ground pattern, and the coverlay; a first signal line pattern extending from the first portion to the second portion, disposed on the flexible dielectric; a second signal line pattern positioned in the second portion; and a second conductive via positioned in the second portion and configured to electrically connect to the first signal line pattern and the second signal line pattern, wherein the second conductive via is configured to penetrate the coverlay and to be electrically isolated from the electromagnetic shielding of the coverlay. ### Claim 15 (depends on 14) The circuit board of claim 14, wherein another portion of the coverlay forms a part of a surface of the circuit board. ### Claim 16 (depends on 14) The circuit board of claim 14, wherein the coverlay further comprises; a first insulation layer extending from the first portion to the second portion, and forming a part of a surface of the circuit board, and a second insulation layer extending from the first portion to the second portion, and positioned between the first insulation layer and the flexible dielectric, and wherein the electromagnetic shielding layer is disposed between the first insulation layer and the second insulation layer, wherein the at least one first conductive via electrically connects the first ground pattern, the second ground pattern, and the electromagnetic shielding layer. ### Claim 17 (depends on 14) The circuit board of claim 14, further comprising: a non-conductive member disposed between the second conductive via and an inner surface of a hole formed in the coverlay such that the second conductive via is physically and electrically separated from the coverlay. ### Claim 18 (depends on 14) The circuit board of claim 14, wherein a first surface protective layer covers a first end of the at least one via and a second surface protective layer covers a second end of the at least one via.