Wafer level package having enhanced thermal dissipation
AssigneeSkyworks Solutions, Inc.
InventorsJoshua James Caron, Eesa Rahimi
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave device including a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode. The polymeric roof layer is spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode. The polymeric roof layer is supported along a span of the polymeric roof layer by at least one pillar. The thermal conductivity of the pillar is greater than the thermal conductivity of the polymeric roof layer. Related wafer-level packages, radio frequency modules and wireless communication devices are also provided.
Claims20
A surface acoustic wave device comprising:
- a piezoelectric layer;
- an interdigital transducer electrode disposed over the piezoelectric layer;
- a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode, the polymeric roof layer being spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode, the polymeric roof layer being supported along a span of the polymeric roof layer by at least one electrically conductive pillar, a thermal conductivity of the at least one electrically conductive pillar being greater than the thermal conductivity of the polymeric roof layer;
- and
- a metallic roof layer disposed over the polymeric roof layer, the at least one electrically conductive pillar being electrically connected to the metallic roof layer.
A wafer-level package comprising:
- a piezoelectric layer;
- an interdigital transducer electrode disposed over the piezoelectric layer;
- and
- a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode, the polymeric roof layer being spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode, the polymeric roof layer being supported along a span of the polymeric roof layer by at least one electrically conductive pillar, a thermal conductivity of the at least one electrically conductive pillar being greater than the thermal conductivity of the polymeric roof layer;
- and
- a metallic roof layer disposed over the polymeric roof layer, the at least one electrically conductive pillar being electrically connected to the metallic roof layer.
A radio frequency module comprising:
- a power amplifier configured to provide a radio frequency signal;
- and
- a surface acoustic wave filter configured to filter the radio frequency signal, the surface acoustic wave filter including a piezoelectric layer, an interdigital transducer electrode disposed over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital electrode transducer, the polymeric roof layer being spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode, the polymeric roof layer being supported along a span of the polymeric roof layer by at least one electrically conductive pillar, a thermal conductivity of the at least one electrically conductive pillar being greater than the thermal conductivity of the polymeric roof layer;
- and
- a metallic roof layer disposed over the polymeric roof layer, the at least one electrically conductive pillar being electrically connected to the metallic roof layer.
A wireless communication device comprising:
- a surface acoustic wave filter configured to provide a filtered radio frequency signal, the surface acoustic wave filter including a piezoelectric layer, an interdigital transducer electrode disposed over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode, the polymeric roof layer being spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode, the polymeric roof layer being supported along a span of the polymeric roof layer by at least one electrically conductive pillar, a thermal conductivity of the at least one electrically conductive pillar being greater than the thermal conductivity of the polymeric roof layer;
- and
- a metallic roof layer disposed over the polymeric roof layer, the at least one electrically conductive pillar being electrically connected to the metallic roof layer.
Dependencies are inferred from the claim text.