Power module and apparatus

An apparatus, comprising:

• a power module and a system board, wherein the system board comprises a plurality of second conductive parts, and the power module comprises:
• a power circuit comprising at least one switch element;
• a magnetic assembly comprising at least one first electrical conductor and a magnetic core module, wherein at least one first electrical conductor passes through the magnetic module, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element, wherein the at least one first electrical conductor is at least one winding of the magnetic assembly;
• a first circuit board comprising a first surface and a second surface opposite to the first surface, wherein the power circuit is disposed on the first surface;
• and
• a plurality of second electrical conductors, wherein one end of each of the second electrical conductors is disposed on one edge of the second surface of the first circuit board and electrically connected with the power circuit, the other end of each of the second electrical conductors is disposed on and electrically connected with the corresponding one of the plurality of second conductive parts, wherein the plurality of second electrical conductors form an input terminal of the power module;
• wherein the power circuit, the magnetic assembly and the system board are arranged in sequence along a same direction;
• wherein the first circuit board further comprises a plurality of half-holes disposed in the second surface of the first circuit board and a plurality of through-holes, wherein the power module comprises a signal pin combination with a plurality of pins, wherein the signal pin combination is located at one edge of the second surface of the first circuit board, and each of the plurality of pins comprises a first contact part and a second contact part, wherein the first contact parts of some of the pins of the signal pin combination pass through the through-holes of the first circuit board, and the first contact parts of the other pins of the signal pin combination are plugged into the half-holes of the second surface of the first circuit board by soldering.