Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages

A system-in-package (SiP) comprising:

• a first circuit layer comprising a plurality of optical modulators, a plurality of photodetectors, a plurality of optical couplers, and a plurality of waveguides, a first waveguide of the plurality of waveguides optically connecting a first optical modulator of the plurality of optical modulators to a first photodetector of the plurality of photodetectors, and one or more additional waveguides optically connecting a first optical coupler of the plurality of optical couplers to the first optical modulator;
• and
• a second circuit layer comprising a first driver, a first amplifier, a first serializer, and a first deserializer, the first driver being electrically connected to the first optical modulator and the first amplifier being electrically connected to the first photodetector, the first serializer being configured to provide output to the first driver and the first deserializer being configured to receive input from the first amplifier, the input and output passing through electrical connections between the first and second circuit layers,
• wherein the first optical modulator, the first driver, the first photodetector, and the first amplifier form a first photonic channel interface configured to receive optical signals from and transmit optical signals to a second photonic channel interface of the SiP connected to the first photonic channel interface via one or more waveguides of the plurality of waveguides,
• wherein the SiP comprises a plurality of nodes each corresponding to a processing element or a memory subsystem, at least one of the nodes being connected to three nearest neighbor nodes by respective bidirectional interchip photonic channels and being connected to a second SiP by a bidirectional interchip photonic channel.