Substrate treating apparatus and substrate treating method
AssigneeSemes Co., Ltd.
InventorsJi Hoon Jeong, Young Dae Chung, Hyun Yoon
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Abstract
Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.
Claims13
A substrate treating method, comprising:
- supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted,
- wherein the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.
A substrate treating method of treating a mask including a plurality of cells, the substrate treating method comprising:
- supplying a liquid to a mask in which a first pattern is formed in the plurality of cells and a second pattern different from the first pattern is formed outside the region where the cells are formed, heating the mask by emitting a laser to the mask supplied with the liquid, and obtaining an image of the mask including a region irradiated with the laser by emitting imaging light for capturing the mask,
- wherein the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.
Dependencies are inferred from the claim text.