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US 12,560,567 B2Granted
MEMS gas sensor and manufacturing method thereof
AssigneeElectronics and Telecommunications Research Institute
InventorsSeungeon Moon, Jeong Hun Kim, Jong Pil Im
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Abstract
Disclosed are a MEMS gas sensor and a manufacturing method thereof. The MEMS gas sensor includes a substrate having a recess, a membrane disposed in the recess and having a through-hole configured to expose a portion of a top surface of the substrate, which is disposed at a central portion of the recess, sensing electrodes disposed in the membrane, and a sensing layer disposed on each of bottom and top surfaces of the membrane and disposed in the through-hole.
Claims13
A MEMS gas sensor comprising:
- a substrate having a recess;
- a membrane disposed in the recess and having a through-hole configured to expose a portion of a top surface of the substrate, the through-hole being disposed at a central portion of the recess;
- sensing electrodes disposed in the membrane;
- and
- a sensing layer disposed on both bottom and top surfaces of the membrane and within the through-hole,
- wherein the sensing layer comprises:
- a lower sensing layer disposed on the bottom surface of the membrane;
- an upper sensing layer disposed on the top surface of the membrane;
- and
- a middle sensing layer disposed in the through-hole and configured to connect the lower sensing layer to the upper sensing layer, the middle sensing layer extending from the lower sensing layer to the upper sensing layer and including a sensing material that is the same as that of the lower sensing layer and the upper sensing layer.
7 more elements
A method for manufacturing a MEMS gas sensor, the method comprising:
- forming a lower insulation layer, a supporting layer, and a middle insulation layer;
- forming a heater layer on the middle insulation layer;
- forming a first upper insulation layer on the heater layer and the middle insulation layer;
- forming sensing electrodes on the first upper insulation layer;
- forming a second upper insulation layer on the first upper insulation layer at the outside of the sensing electrodes;
- forming a preliminary recess and a through-hole by removing a portion of each of the first and second upper insulation layers, the middle insulation layer, the supporting layer, the lower insulation layer, and the substrate between the outside of the sensing electrodes and the sensing electrodes;
- forming a sensing layer to fill the through-hole between the sensing electrodes;
- and
- forming a recess by additionally removing a portion of the substrate below the sensing layer,
- wherein the sensing layer comprises:
- a lower sensing layer formed in the recess and disposed on a bottom surface of the lower insulation layer;
- an upper sensing layer formed on the sensing electrodes and disposed on a top surface of the first upper insulation layer;
- and
- a middle sensing layer disposed in the through-hole and configured to connect the lower sensing layer to the upper sensing layer, the middle sensing layer extending from the lower sensing layer to the upper sensing layer and including a sensing material that is the same as that of the lower sensing layer and the upper sensing layer.
11 more elements
Dependencies are inferred from the claim text.