Reactive gas modulation for group III/IV compound deposition systems
OwnerRobbie J. Jorgensoninventor
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OwnerRobbie J. Jorgensoninventor
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A process for producing semiconductor structures comprising one of more layers of Group III/IV Compounds deposited onto a template using PVD sputtering the resulting semiconductor structures is provided according to the invention. The Group III or Group IV material may be gallium, hafnium, indium, aluminum, silicon, germanium, magnesium and/or zirconium. The anion provided by a reactive gas may be nitride, oxide, arsenide, or phosphide. The flow of the reactive gas to the vacuum chamber used to react with the sputtered Group III or Group IV target material for produce the Group III/IV Compound layer onto the template is modulated during a duty cycle during the PVD sputtering process between a target-rich condition and a reactive gas-rich condition to enhance the efficiency of the PVD sputtering process and improve the crystallinity of the Group III/IV Compound layer within the resulting semiconductor structure.
A method for growing a Group III or IV Compound semiconductor structure for a semiconductor device inside a vacuum chamber having a cathode and a plurality of anodes, comprising:
Dependencies are inferred from the claim text.