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US 12,559,823 B2Granted
Tungsten wire, and tungsten wire processing method and electrolytic wire using the same
AssigneeNiterra Materials Co., Ltd.
InventorsHitoshi Aoyama, Hideaki Baba, Masanori Mizobe, Kenji Tomokiyo
Life of this patent
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Abstract
According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
Claims12
A tungsten wire comprising a tungsten alloy containing rhenium, and the tungsten wire comprising a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
Dependencies are inferred from the claim text.