Bubble ejection method, bubble ejecting device, and bubble ejection apparatus

A bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises:

• a substrate formed of a dielectric,
• at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate,
• a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and
• a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising:
• disposing a conductive liquid onto a processing target;
• bringing a portion including at least the first opening and the second opening into contact with the conductive liquid;
• bringing a first electrode into contact with the conductive liquid on the first opening side and bringing a second electrode into contact with the conductive liquid on the second opening side;
• applying a voltage between the first electrode and the second electrode;
• ejecting a whole bubble from the bubble ejection hole onto the processing target through the conductive liquid disposed outside the bubble ejection hole.