Polysiloxane-containing temporary adhesive comprising heat-resistant polymerization inhibitor

A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive comprising

• a component (A) that is cured by a hydrosilylation reaction, wherein the component (A) comprises a polysiloxane (A1) including
• a polyorganosiloxane (a1) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO2, a M unit of R1R2R3SiO1/2, a D unit of R4R5SiO2/2, and a T unit of R6SiO3/2, with the proviso that R1 to R6 each are a C1-10 alkyl group or a C2-10 alkenyl group bonded to a silicon atom and the polyorganosilxoane (a1) contains a C1-10 alkyl group and a C2-10 alkenyl group, and
• a polyorganosiloxane (a2) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO2, a M unit of R1R2R3SiO1/2, a D unit of R4R5SiO2/2, and a T unit of R6SiO3/2, wherein R1 to R6 each are a C1-10 alkyl group or a hydrogen atom bonded to a silicon atom and the polyorganosiloxane (a2) contains a C1-10 alkyl group and a hydrogen atom;
• an epoxy group-containing polydimethylsiloxane, a phenyl group-containing polydimethylsiloxane, or a mixture thereof;
• a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA;
• and
• a solvent (C).