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US 12,559,654 B2Granted
High-frequency dielectric heating adhesive sheet, joining method, and joined body
AssigneeLintec Corporation
InventorsKoji Tsuchibuchi, Naoki Taya
Life of this patent
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Abstract
A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.
Claims15
A high-frequency dielectric heating adhesive sheet comprising an adhesive layer that comprises:
- a thermoplastic resin (A) comprising a reactive site (Y);
- a dielectric material that generates heat upon application of a high-frequency electric field;
- and
- a silane coupling agent (C),
- wherein the silane coupling agent (C) comprises a functional group (X) and an alkoxysilyl group (Z),
- wherein a main chain linking the functional group (X) with a silicon atom of the alkoxysilyl group (Z) comprises eight or more atoms, excluding atoms of side chains bonded to atoms forming the main chain and hydrogen atoms on the main chain.
3 more elements
Dependencies are inferred from the claim text.