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US 12,559,415 B2Granted
Low-temperature fired, lead-free glass frit, paste, and vacuum glass assembly using same
AssigneeLG Electronics Inc.
InventorsWongyu Choi, Young Seok Kim
Life of this patent
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Abstract
A glass frit according to this application may include a composition of P2O5, V2O5, TeO2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.
Claims6
A glass frit, consisting of:
- 30 to 50 weight percent (wt %) of vanadium pentoxide (V2O5);
- 30 to 50 wt % of tellurium dioxide (TeO2);
- 1 to 5 wt % of copper oxide (CuO);
- 1 to 5 wt % of barium oxide (BaO);
- 1 to 10 wt % of at least one of manganese dioxide MnO2, FeO3, stannous oxide (SnO), molybdenum trioxide (MoO3), or zinc oxide (ZnO);
- 5 to 20 wt % of at least one of silver oxide (Ag2O) or bismuth oxide (Bi2O3);
- and
- 5 to 30 wt % of an inorganic filler.
5 more elements
Dependencies are inferred from the claim text.