3D microelectrode array (MEA) for optical and electrical probing of electrogenic cells
AssigneesUniversity of Central Florida Research Foundation, Inc., AXOSIM, Inc.
InventorsSwaminathan Rajaraman, Charles M. Didier, Avra Kundu, Lowry Curley, Michael J. Moore, Hieu Nguyen, Corey Rountree
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Abstract
Disclosed herein are novel 3D microelectrode arrays (3D MEA) that include a substrate body (e.g. chip), microneedles, traces, and a well, wherein the 3D MEA provides for transfer of electrical signals on one side of the substrate body to the other side of the substrate body. Methods for using 3D MEAs to grow electrogenic cells and obtain electrophysiological signals are disclosed as well. Fabrication techniques for producing the 3D MEAs are also disclosed.
Claims20
A method of making a three-dimensional microelectrode array (3D MEA) comprising;
- forming a plurality of cut-outs onto a planar conductive substrate;
- transitioning material at the plurality of the cut-outs such that a plurality of microneedles extend orthogonally to the planar conductive substrate;
- cutting the planar conductor substrate to release the plurality of microneedles from the planar conductive sheet to produce a released plurality of microneedles;
- and
- securing the released plurality of microneedles to a transparent planar substrate comprising a top surface, a bottom surface and an edge surface disposed on a side of the transparent planar substrate and between the top and bottom surfaces;
- wherein one or more conductive traces have been deposited on both the edge surface and the bottom or top surface of the transparent planar substrate, or both, and wherein the released plurality of microneedles is secured suprajacent to the conducted traces such that at least one microneedle of the plurality of microneedles and at least one conductive trace of the one or more conductive traces are conductively connected.
Dependencies are inferred from the claim text.