Temperature insensitive backing structure for intraluminal imaging devices

An apparatus, comprising:

• a flexible elongate member comprising a distal portion and a proximal portion, wherein the flexible elongate member comprises an outer diameter sized to be positioned inside a patient body;
• and
• an imaging assembly coupled to the distal portion of the flexible elongate member, wherein the imaging assembly comprises:
• an integrated circuit (IC) layer comprising a first material;
• an acoustic layer comprising an array of ultrasound transducer elements, wherein the acoustic layer is coupled to the IC layer;
• a backing layer coupled to the IC layer, wherein the backing layer comprises a second material;
• and
• a support layer coupled to the backing layer, wherein the support layer comprises a third material, and wherein a coefficient of thermal expansion (CTE) difference between the first material and the third material is less than the CTE difference between the first material and the second material,
• wherein the IC layer, the acoustic layer, the backing layer, and the support layer are sized to fit within the outer diameter,
• wherein the acoustic layer is a located on a top side of the IC layer and the backing and support layers are located on a bottom side of the IC layer such that:
• the backing layer and the support layer are located on a same side of the IC layer;
• and
• the IC layer and the support layer are located on opposite sides of the backing layer.