Semiconductor device manufacturing device and manufacturing method

A semiconductor device manufacturing device, comprising:

• a stage on which a substrate is mounted;
• a bonding head, sucking and holding a chip by using a holding surface opposite to the stage, and being relatively movable with respect to the stage in a surface direction and a normal direction of the stage;
• a copying mechanism, provided in the bonding head, and provided with a fixed member comprising one of a concave spherical surface and a convex spherical surface and a movable member comprising another of the concave spherical surface and the convex spherical surface and provided to be swingable with the holding surface with respect to the fixed member;
• and
• a controller, executing a copying process adjusting a facing surface, which is an end surface of the chip held on the holding surface or the holding surface, to be parallel to a reference plane, which is a planar surface of a substrate held by the stage or a planar surface of the stage, by having the facing surface follow the reference plane,
• wherein the copying mechanism is switchable between a free state in which the movable member is swingable and a locked state in which swinging of the movable member is limited, and
• in the copying process, the controller moves the bonding head relative to the surface direction of the reference plane while keeping the facing surface abutting against the reference plane in a state in which the copying mechanism is switched to the free state until an axial direction position of the bonding head reaches a predetermined reference position, and switches the copying mechanism to the locked state at a time when the axial direction position reaches the reference position.