Detachment chamber for detaching a piezoelectric layer from a donor substrate
AssigneeSoitec
InventorCédric Charles-Alfred
Life of this patent
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Abstract
A detachment chamber for detaching a piezoelectric layer from a piezoelectric donor substrate includes at least one chuck having at least one electrode configured to apply an electric field to the piezoelectric donor substrate to detach the piezoelectric layer from the piezoelectric donor substrate.
Claims19
A detachment chamber for detaching a piezoelectric layer from a piezoelectric donor substrate, the detachment chamber comprising one or more chucks configured to apply an electric field through the piezoelectric donor substrate to detach the piezoelectric layer from the piezoelectric donor substrate, the one or more chucks comprising at least one positive electrode and at least one negative electrode configured to apply the electric field substantially parallel to a polarization direction of the piezoelectric donor substrate.
A detachment chamber for detaching a piezoelectric layer from a piezoelectric donor substrate, the detachment chamber comprising:
- a first chuck comprising at least one positive electrode and a second chuck comprising at least one negative electrode, wherein the first chuck and the second chuck are spaced apart from each other with the at least one positive electrode of the first chuck facing the at least one negative electrode of the second chuck,
- wherein the at least one positive electrode and the at least one negative electrode are configured to apply an electric field through the piezoelectric donor substrate to detach the piezoelectric layer from the piezoelectric donor substrate, the electric field being substantially parallel to a polarization direction of the piezoelectric donor substrate.
A method of forming a substrate comprising a support substrate and a piezoelectric layer, the method comprising:
- providing a chamber comprising at least one chuck, the at least one chuck comprising at least one positive electrode and at least one negative electrode, the at least one positive electrode and the at least one negative electrode configured to apply an electric field to the assembly;
- forming a predetermined splitting area in a piezoelectric donor substrate, the predetermined splitting area delimiting the piezoelectric layer to be transferred from the piezoelectric donor substrate;
- bonding the piezoelectric donor substrate to the support substrate to form an assembly, wherein the piezoelectric layer is adjacent to the support substrate;
- and
- applying the electric field to the assembly and through the piezoelectric donor substrate with the at least one electrode at a temperature of less than 100° C. to detach the piezoelectric layer from the piezoelectric donor layer and transfer the piezoelectric layer to the support substrate, the electric field being substantially parallel to a polarization direction of the piezoelectric donor substrate.
Dependencies are inferred from the claim text.