Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process
AssigneeSTMicroelectronics (Grenobles 2) SAS
InventorsKarine Saxod, Nicolas Mastromauro
Life of this patent
Estimating the term…
Abstract
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.
Claims16
A process for fabricating an electronic device, comprising:
- mounting an encapsulating cover on a carrier substrate configured to carry at least one electronic chip and having a front face;
- wherein mounting comprises:
- bringing the encapsulating cover into contact with the carrier substrate through a plurality of seating protrusions spaced apart from each other, each seating protrusion having a seating surface through which said encapsulating cover and said carrier substrate make contact;
- and
- securely fastening the encapsulating cover to the carrier substrate using at least one adhesive bead placed at locations between the seating protrusions and wherein said at least one adhesive bead is not placed between the seating surface of each seating protrusion and the front face of the carrier substrate.
A process for fabricating an electronic device, comprising:
- providing an encapsulating cover including an exterior lateral border with a rear edge and a plurality of seating feet extending from the rear edge;
- wherein each seating foot includes a seating surface;
- and
- mounting the encapsulating cover on a carrier substrate configured to carry at least one electronic chip and having a front face;
- wherein mounting comprises:
- bringing the seating surface of each seating foot into contact with the front face of the carrier substrate;
- and
- then applying an adhesive bead to the rear edge of the exterior lateral border of the encapsulating cover to secure the encapsulating cover to the carrier substrate.
A process for fabricating an electronic device, comprising:
- providing an encapsulating cover including an exterior lateral border with a rear edge;
- providing a carrier substrate having a front face with seating bases that protrude perpendicularly from said front face;
- wherein each seating base includes a front surface;
- and
- mounting the encapsulating cover on a carrier substrate configured to carry at least one electronic chip and having a front face;
- wherein mounting comprises:
- bringing the rear edge of the encapsulating cover into contact with the front surface of each seating base of the carrier substrate;
- and
- then applying an adhesive bead to the rear edge of the exterior lateral border of the encapsulating cover to secure the encapsulating cover to the carrier substrate.
Dependencies are inferred from the claim text.