Encapsulation adhesive film
AssigneeHangzhou First Applied Material Co., Ltd.
InventorsXiang Chen, Haiyun Wu
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AssigneeHangzhou First Applied Material Co., Ltd.
InventorsXiang Chen, Haiyun Wu
Estimating the term…
The present disclosure discloses an encapsulation adhesive film 100, comprising an adhesive film body and a surface pattern provided on at least one surface of the adhesive film body, and the surface pattern comprising a first pattern extending basically along a first direction and a second pattern extending basically along a second direction, the first direction intersecting the second direction at a predetermined angle α, the predetermined angle α being greater than 0° and less than 180°; the surface pattern comprising at least one of the first pattern and at least one of the second pattern. The surface pattern on the surface of the encapsulation adhesive film 100 effectively solves the technical problems in the prior art, achieving the enhancement of the adhesion of the encapsulation adhesive film 100 on the photovoltaic substrate, and reducing the displacement problem during the process of laying the photovoltaic modules.
An encapsulation adhesive film comprising an adhesive film body, wherein the encapsulation adhesive film further comprises:
Dependencies are inferred from the claim text.