Light-emitting substrate and manufacturing method thereof
AssigneeTcl China Star Optoelectronics Technology Co., Ltd.
InventorYongchao Zhao
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Abstract
A light-emitting substrate and a manufacturing method thereof are provided. The reactivity of part of the ink layer outside the preset area that is far from the light with the first preset wavelength is improved by a heating process. Thus, the part of the ink layer reacts sufficiently under irradiation of the light with the first preset wavelength at lower energy. This improves an undercut issue caused by insufficient curing of the ink layer outside the preset area far from the light with the first preset wavelength, thereby preventing the ink layer from being peeled off from the light-emitting substrate.
Claims19
A manufacturing method of a light-emitting substrate, comprising:
- providing an array substrate comprising a substrate and a conductive pad disposed on the substrate;
- forming an ink layer covering the conductive pad and the substrate, wherein the ink layer is defined with a preset area corresponding to a position of the conductive pad, wherein the ink layer is a white ink layer, and a thickness of the ink layer is greater than or equal to 40 μm and less than or equal to 70 μm;
- irradiating the ink layer outside the preset area from a first side by light with a first preset wavelength while heating the ink layer outside the preset area from a second side, wherein the first side is one of a side of the substrate away from the ink layer and a side of the ink layer away from the substrate, and the second side is another one of the side of the substrate away from the ink layer and the side of the ink layer away from the substrate, wherein the first side and the second side are opposite sides;
- removing the ink layer in the preset area to obtain a patterned ink layer;
- and
- bonding a light-emitting unit on the conductive pad to obtain the light-emitting substrate.
A manufacturing method of a light-emitting substrate, comprising:
- providing an array substrate comprising a substrate and a conductive pad disposed on the substrate;
- forming an ink layer covering the conductive pad and the substrate, wherein the ink layer is defined with a preset area corresponding to a position of the conductive pad;
- irradiating the ink layer outside the preset area from a first side by light with a first preset wavelength while heating the ink layer outside the preset area from a second side, wherein the first side is one of a side of the substrate away from the ink layer and a side of the ink layer away from the substrate, and the second side is another one of the side of the substrate away from the ink layer and the side of the ink layer away from the substrate, wherein the first side and the second side are opposite sides;
- removing the ink layer in the preset area to obtain a patterned ink layer;
- and
- bonding a light-emitting unit on the conductive pad to obtain the light-emitting substrate.
Dependencies are inferred from the claim text.