Integrated chip inductor structure

An inductor structure, comprising:

• an interconnect structure over a semiconductor substrate;
• a first etch stop layer over the interconnect structure;
• a first magnetic structure over the first etch stop layer, wherein the first magnetic structure comprises a cobalt zinc tantalum (CZT) layer between a lowermost tantalum layer and a topmost oxygen-CZT layer;
• one or more conductive wires over the first magnetic structure and defining an inductor;
• and
• a pattern enhancement layer between the lowermost tantalum layer and the first etch stop layer.

An inductor structure, comprising:

• an interconnect structure over a substrate;
• a first magnetic structure over the interconnect structure and comprising a first plurality of stacked layers;
• a first conductive wire and a second conductive wire extending in parallel over the first magnetic structure;
• an etch stop layer over the first conductive wire and the second conductive wire;
• a second magnetic structure over the etch stop layer and comprising a second plurality of stacked layers;
• and
• a pattern enhancement layer between and directly contacting the second magnetic structure and the etch stop layer.