High frequency circuit

A high frequency circuit comprising:

• a first insulating layer;
• a second insulating layer stacked on the first insulating layer directly or with one or more intermediate layers interposed therebetween;
• a first ground disposed on a first surface of the first insulating layer, the first surface and a second surface forming two surfaces of the first insulating layer, the first surface being a surface that does not face the second insulating layer;
• a first line and a second line disposed between the first insulating layer and the second insulating layer, the first line having a first end portion to which a first alternating-current signal is to be supplied, the second line having a second end portion to which a second alternating-current signal is to be supplied;
• a second ground disposed on a third surface of the second insulating layer, the third surface and a fourth surface forming two surfaces of the second insulating layer, the third surface being a surface that does not face the first insulating layer;
• a third ground disposed between the first insulating layer and the second insulating layer;
• and
• a first shield via that is conductive, the first shield via being located between the first end portion and the second end portion, the first end portion and the second end portion being isolated from each other in a direction along the fourth surface, the first shield via extending through at least one insulating layer among the first insulating layer and the second insulating layer and being connected to the third ground and a ground located on a side on which the at least one insulating layer is located with respect to the first end portion and the second end portion among the first ground and the second ground, wherein
• a cross section of the first shield via parallel to the second surface is inscribed in a first virtual rectangle having a long side and a short side perpendicular to the long side.