Integration of radio frequency front-end for size reduction and improved performance
AssigneeApple Inc.
InventorsSidharth S. Dalmia, David M. Signoff, Jennifer M. Edwards
Life of this patent
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Abstract
A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.
Claims20
A radio frequency package comprising:
- a multi-layer board;
- an insulation film substrate disposed on the multi-layer board;
- a front-end package including a radio frequency (RF) front-end die and a power control die connected to the insulation film substrate with a first plurality of connectors;
- an antenna array disposed on the multi-layer board and configured to provide a wireless communication functionality;
- a mold disposed on the antenna array;
- a plurality of via connectors extending vertically through the mold and connecting the antenna array to the multi-layer board;
- and
- a plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected to the antenna array with a second plurality of connectors.
A radio frequency package comprising:
- a multi-layer board;
- an insulation film substrate disposed on the multi-layer board;
- a front-end package including a radio frequency (RF) front-end die and a power control die connected onto the insulation film substrate with a first plurality of connectors;
- a plurality of antenna arrays, each antenna array of the plurality of antenna arrays configured to provide a wireless communication functionality;
- a plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected onto a respective antenna array of the plurality of antenna arrays with a second plurality of connectors;
- a plurality of molds, wherein each mold of the plurality of molds is disposed on the respective antenna array of the plurality of antenna arrays, and wherein each transceiver die of the plurality of transceiver dies is disposed in a respective mold of the plurality of molds;
- and
- a plurality of via connectors extending vertically through the plurality of molds and connecting the plurality of antenna arrays to the multi-layer board.
A radio frequency package comprising:
- an antenna array configured to provide a wireless communication functionality;
- a stepped mold disposed on the antenna array;
- a front-end package including a radio frequency (RF) front-end die and a power control die disposed in the stepped mold;
- and
- a plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected onto the antenna array with a first plurality of connectors.
Dependencies are inferred from the claim text.