Electronic component

An electronic component, comprising:

• a capacitor element;
• an inductor element connected electrically to the capacitor element;
• and
• an interlayer-insulation layer between the capacitor element and the inductor element, wherein
• the interlayer-insulation layer has a first principal surface, a second principal surface, and a via hole through the interlayer-insulation layer between the first principal surface and the second principal surface,
• the capacitor element is at a side of the second principal surface of the interlayer-insulation layer and includes a first electrode layer, a second electrode layer, and a dielectric layer interposed between the first electrode layer and the second electrode layer,
• the inductor element is at a side of the first principal surface of the interlayer-insulation layer and includes an inductor wire that has an inductor portion disposed on the first principal surface and also has a via portion through the via hole so as to connect the inductor portion to the second electrode layer,
• the inductor wire further includes a contact layer, a conducting layer in contact with the contact layer, and a metal layer in contact with the conducting layer, and
• the contact layer is in continuous contact with the first principal surface, an inside surface of the via hole, and the second electrode layer,
• wherein the interlayer-insulation layer is made of an organic insulating material selected from the group consisting of an epoxy-based material, phenol-based material, liquid polymer-based material, polyimide-based material, acrylic-based material, and a mixture thereof,
• wherein the second electrode layer includes a second contact layer in contact with the dielectric layer and a second metal layer in contact with the second contact layer.