Overlay marks for reducing effect of bottom layer asymmetry
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Chih Hsieh, Kai-Hsiung Chen, Po-Chung Cheng
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Chih Hsieh, Kai-Hsiung Chen, Po-Chung Cheng
Estimating the term…
Methods of fabricating and using an overlay mark are provided. In some embodiments, the overlay mark includes an upper layer and a lower layer disposed below the upper layer. The lower layer includes a first plurality of compound gratings extending in a first direction and disposed in a first region of the overlay mark, each of the first plurality of compound gratings including one first element and at least two second elements disposed on one side of the first element, and a second plurality of compound gratings extending the first direction and disposed in a second region of the overlay mark, each of the second plurality of compound gratings including one third element and at least two fourth elements on one side of the third element. The first plurality of compound gratings is a mirror image of the second plurality of compound gratings.
A combination overlay mark, comprising:
A semiconductor device, comprising:
A combination overlay mark, comprising:
Dependencies are inferred from the claim text.